Potting, coating, staking material and other encapsulants are used regularly in the electronics industry to guard against environmental conditions that could otherwise damage an assembly. However, these polymeric materials can have thermal and mechanical properties that vary significantly. If the material properties of coatings and pottings are not understood during the design process, they can create complex loading conditions that negatively affect solder joint reliability.
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Solder joint overstress failure typically manifests as a pad crater or a joint fracture along the intermetallic connection (IMC). A pad crater is a crater-shaped crack in the laminate layer beneath the copper pad of a solder joint. The IMC is the region where the copper pad and solder combine to form Cu3Sn or Cu6Sn5. It is the most brittle region of the solder joint, which is why it is the area most susceptible to overstress.
Just like you may have seen on TV or the local rink when a hole is created in the ice, the ref/players will scrape some ice shavings, pack them in the hole, wet it and then smooth it over with a puck. Same goes for your backyard rink. Grab some snow, assuming you have some, and pack it in the holes and cracks, wet lightly and smooth over the best you can with a puck, or even a concrete trowel and let it freeze. 2ff7e9595c
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